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| (R) STPS1H100A/U HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS NEGLIGIBLE SWITCHING LOSSES HIGH JUNCTION TEMPERATURE CAPABILITY LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP AVALANCHE RATED DESCRIPTION Schottky rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC/DC converters. Packaged in SMA or SMB. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage TL = 160C = 0.5 tp = 10 ms sinusoidal tp = 2 square F = 1kHz tp = 100 s square Parameter Repetitive peak reverse voltage Value 100 10 1 50 1 1 - 65 to + 175 175 10000 Unit V A A A A A C C V/s 1A 100 V 175 C 0.62 V SMA (JEDEC DO-214AC) STPS1H100A SMB (JEDEC DO-214AA) STPS1H100U *: dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j-a) dTj July 1999 - Ed: 3A 1/6 STPS1H100A/U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMA SMB STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF ** Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 5 ms, < 2% ** tp = 380 s, < 2% Value 30 25 Unit C/W Min. Typ. Max. 1 Unit A mA V VR = VRRM 0.2 IF = 1 A IF = 1 A IF = 2 A IF = 2 A 0.65 0.58 0.5 0.77 0.62 0.86 0.7 To evaluate the maximum conduction losses use the following equation : P = 0.54 IF(AV) + 0.08 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 IF(av) (A) =tp/T T =1 = 0.05 = 0.1 = 0.2 Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) 1.2 = 0.5 Rth(j-a)=Rth(j-l) 1.0 0.8 0.6 0.4 0.2 tp Rth(j-a)=120C/W Rth(j-a)=100C/W T 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 =tp/T tp Tamb(C) 60 80 100 120 140 160 180 0.0 0 20 40 2/6 STPS1H100A/U Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). IM(A) 10 9 8 7 6 5 4 3 IM 2 1 0 1E-3 8 7 6 Ta=25C Ta=75C Fig. 4: Non repetitive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) 5 4 3 Ta=25C Ta=75C Ta=110C t 2 1 Ta=110C IM t =0.5 t(s) 1E-2 1E-1 1E+0 0 1E-3 =0.5 t(s) 1E-2 1E-1 1E+0 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Zth(j-a)/Rth(j-a) 1.00 = 0.5 Fig. 6: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.00 =0.5 = 0.2 = 0.1 =0.2 =0.1 0.10 Single pulse 0.10 T Single pulse T tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 =tp/T tp tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 =tp/T tp 1E+2 5E+2 1E+2 5E+2 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 2E+2 1E+2 1E+1 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 100 Tj=125C F=1MHz Tj=25C 50 1E+0 1E-1 Tj=25C 20 VR(V) 1E-2 VR(V) 60 70 80 90 100 1E-3 0 10 20 30 40 50 10 1 10 100 3/6 STPS1H100A/U Fig. 9: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMB). Rth(j-a) (C/W) 120 110 100 90 80 70 60 50 40 30 20 0.0 0.5 1.0 1.5 Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMA). Rth(j-a) (C/W) 140 130 120 110 100 90 80 70 60 50 40 S(Cu) (cm) 30 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 S(Cu) (cm) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3.5 4.0 4.5 5.0 Fig. 11: Forward voltage drop versus forward current (maximum values). IFM(A) 2E+1 1E+1 Tj=125C 1E+0 Tj=25C 1E-1 VFM(V) 1E-2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 4/6 STPS1H100A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 D A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c E A1 E1 C L A2 D b L FOOT PRINT (in millimeters) 1.65 1.45 2.40 1.45 5/6 STPS1H100A/U PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c E A1 E1 C L A2 D b L FOOT PRINT (in millimeters) 2.3 1.52 Ordering type STPS1H100A STPS1H100U 2.75 Marking S11 G11 1.52 Package SMA SMB Weight 0.068g 0.107g Base qty 5000 2500 Delivery mode Tape & reel Tape & reel Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 6/6 |
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